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Heavy Copper
Production Capablity: 8oz
Pilot Capablity: 12oz
Area of Application: Power module in power conversion and Power module
A. Inner Layer Capability
Maximum Inner layer copper thickness：12oz(400um)
line width/line spacing:20mil/20mil(Trace top)
Etch factor:2.5
B. Outer Layer Capability
Maximum Inner layer copper thickness：6oz(200um)
line width/line spacing:16mil/16mil
Etch factor:1.8
C. Blind Via
HDI Penetrable Inner copper thickness :3oz(105um)
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